Chip-Transfer
Transfer components onto donor PCBs while maintaining precise alignment.
Where a target component is intact but the surrounding board is not, it can be transferred to a matching donor board for the laboratory’s downstream workflow. Successful transfer requires accurate placement across every connection.
Visible heatingFocused Infrared controls the transfer cycle
The target area stays visible while Focused Infrared supplies adjustable heat from above and the PCB is conditioned from below.
Heating profileThe thermal cycle is managed in software
ThermoActive software displays and stores the heating profile so the transfer cycle can be reviewed and repeated.
Split beam alignmentComponent and footprint in one view
A split beam prism overlays the component and its landing site in a single optical view at up to x50 magnification. Placement accuracy is up to 10 microns, so every ball meets its pad.
Component handlingControlled pickup and placement
The component is picked up, aligned and placed onto the donor PCB as part of the controlled transfer procedure.
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