Chip-Replacement
Replace damaged components, such as power ICs and ports, to support downstream board examination.
Fire, water, impact and corrosion often damage surface-mount components before the memory devices. Removing and replacing those components on a damaged board requires even, controlled heating that a compromised laminate can tolerate. Controlled infrared preheating provides this.
Visible heatingFocused Infrared on the replacement area
Focused, adjustable infrared directs heat to the selected component while keeping the surrounding assembly and the target area in view.
Independent sensingComponent and PCB temperatures measured separately
Non-contact sensors provide independent feedback from the component and the PCB throughout the replacement cycle.
Heating profileReplacement profile displayed in software
ThermoActive software manages the temperature targets and displays the live heating profile for a controlled, repeatable cycle.
Controlled finishControlled cooling
Assisted cooling brings the board down in a controlled way after reflow, stabilising the solder joints so the board can be handled and moved on to imaging.
Contact PDR Forensics
Choose a general, sales or technical enquiry and speak directly with the PDR team in Crawley.