Chip-Off
Chip-Transfer
Chip-Replacement
Designed and manufactured by PDR for digital forensic laboratories.
Controlled thermal profiles remove the memory device intact, ready for reading in the laboratory’s own validated tools.
Focused infrared platforms for forensic electronics
What is a Chipmate?
A focused infrared platform for forensic electronics. It removes, transfers and replaces semiconductor components so that the memory can be read afterwards using the laboratory’s own validated tools.
How it works
- Controlled, non-contact infrared heating from above and below
- Software-managed thermal profiles for repeatable results
- Precise ramp and dwell control for damaged and heat-sensitive assemblies
- Non-contact temperature sensing and side-view image capture
Why PDR?
PDR has designed and manufactured focused infrared systems in the UK for four decades, with over 5,000 systems supplied worldwide. Focused infrared directs energy to the target component, supporting controlled and repeatable removal on high-value assemblies.
Chipmate Pro — the laboratory standard
Memory devices often remain readable after the assembly is damaged.
In many devices, the memory remains readable after the surrounding assembly has been damaged or the device has been locked. Before the memory can be read, the memory device must be removed, transferred to a working board, or damaged components replaced. PDR systems provide the controlled infrared heating these procedures require.
Thermal control
Successful component removal depends on precise thermal control. Solder melts within a narrow temperature range, close to the memory die. Independent infrared sensing holds the component and the board on separate, controlled profiles.
Repeatable process
Thermal profiles are defined in software and can be stored, repeated and recorded. This supports the laboratory’s own validation, verification and record-keeping.
Performed in-house
Hardware preparation is carried out on the laboratory’s own bench, so the device remains within its control throughout.
Damaged assemblies
Focused infrared removes components from boards that are fire-damaged, water-damaged, corroded or physically broken, and delivers them intact for reading.
Three supported procedures
Chip-Off
Remove eMMC, eMCP, UFS, NAND, CPUs, PMICs and other semiconductor devices.
Learn more 02Chip-Transfer
Transfer components onto donor PCBs while maintaining precise alignment.
Learn more 03Chip-Replacement
Replace damaged components such as power ICs and ports so the board can be read.
Learn moreFocused infrared heating
Precision heatingDirected thermal energy
Focused, adjustable, visible infrared heats the target component. The heated area is visible throughout the procedure, and thermal profiles are managed in software for controlled, repeatable results.
Three systems. One core.
The Chipmate, Chipmate Pro and Chipmate Auto share the same focused infrared heating, sensing and software. They differ in placement, sensing and level of automation.
Arrange a demonstration
See the system operate on representative devices and boards, and discuss your laboratory’s requirements with our engineers.