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Controlled manual

Chipmate

ApplicationsChip-Off

A manual Focused Infrared system for laboratories introducing a defined, repeatable chip-off process.

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Chipmate · PDR ForensicsPDR Chipmate chip-off system
Quick specification
Max PCB size300 x 450 mm
Max component size55 x 55 mm
Component removalHand-held vacuum tool
Component sensingNon-contact IR sensor
Full specification ↓

Focused infrared heating.

150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.

Independent temperature control.

Board and component temperatures are managed separately, for full control of the procedure.

ThermoActive software.

Automatic profiling keeps every thermal procedure controlled and repeatable.

See it working

The process, in view.

Real PDR process footage showing the control, sensing and handling functions used across the Chipmate workflow.

Focused Infrared heating

Adjustable, visible energy directed to the target area.

Live ThermoActive profile

The component and PCB heating profile is visible throughout the process.

Controlled component removal

The dedicated Chipmate removal procedure, cut around the actual pickup movement.

Stable board support

The adjustable workholder positions the PCB over the preheater.

System capability

Built for a controlled procedure.

PCB preheater.

2800W three-zone medium-wave quartz infrared gives controlled, even thermal conditioning from below.

PCB workholder.

Adjustable support positions the board securely and prevents warping.

Technical specification

  • Max PCB size300 x 450 mm
  • Max component size55 x 55 mm
  • Min component size01005 package
  • Component removalHand-held vacuum tool
  • Top heater power150W focused IR, up to Ø70 mm spot
  • PCB preheater power2800W medium-wave IR, 3 zones
  • Preheater heating area360 x 240 mm
  • Component sensingNon-contact IR sensor
  • PCB sensingK-type thermocouple
  • Thermocouple channels4