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Chip-Off + Chip-Transfer

Chipmate Pro

ApplicationsChip-OffChip-Transfer

A professional forensic system for controlled Chip-Off and Chip-Transfer, with non-contact component and PCB sensing, controlled pickup and precise optical alignment.

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Chipmate Pro · PDR ForensicsPDR Chipmate Pro chip-off system
Quick specification
Max PCB size300 x 450 mm
Max component size55 x 55 mm
Component removalManual pick-up system
Component sensingNon-contact IR sensor
Full specification ↓

Focused infrared heating.

150W focused, adjustable, visible infrared delivers precise energy while protecting the surrounding evidence.

Independent temperature control.

Board and component temperatures are managed separately.

ThermoActive software.

Automatic profiling for a controlled, repeatable thermal procedure.

See it working

The process, in view.

Real PDR process footage showing the control, sensing and handling functions used across the Chipmate Pro workflow.

Focused Infrared heating

Visible heat directed to the target component.

Independent temperature sensing

Component and PCB temperatures monitored separately.

Controlled component removal

The Chipmate Pro pickup sequence in a concise cut with the extended flux smoke removed.

Live ThermoActive profile

Software shows the heating profile and live temperature traces.

System capability

Built for a controlled procedure.

PCB preheater.

2800W three-zone medium-wave quartz infrared reduces thermal gradients across the board.

Optical alignment.

Split beam prism system for precise component placement and transfer.

Side-view monitoring.

Live camera with image capture for process records.

Flux application.

Precise nest and flux paste application.

Assisted PCB cooling.

Stabilises joints after the procedure.

Stable PCB support.

Adjustable workholder prevents warping.

Technical specification

  • Max PCB size300 x 450 mm
  • Max component size55 x 55 mm
  • Min component size01005 package
  • Component removalManual pick-up system
  • Component placementSplit beam prism, x50 magnification
  • Placement accuracyUp to 10 microns
  • Top heater power150W focused IR, up to Ø70 mm spot
  • PCB preheater power2800W medium-wave IR, 3 zones
  • Preheater heating area360 x 240 mm
  • Component sensingNon-contact IR sensor
  • PCB sensingNon-contact IR sensor
  • Thermocouple channels4