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Assisted automation

Chipmate Auto

ApplicationsChip-OffChip-TransferChip-Replacement

Focused Infrared processing with automated removal movement and assisted alignment and placement for repeatable forensic workflows.

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Chipmate Auto · PDR ForensicsPDR Chipmate Auto chip-off system
Quick specification
Max PCB size300 x 450 mm
Max component size55 x 55 mm
Component removalAutomatic removal and placement
Component sensingNon-contact IR sensor
Full specification ↓

Automatic removal and placement.

The system lifts and places components automatically at the precise moment, taking operator variability out of the most delicate step.

Focused infrared heating.

150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.

Independent temperature control.

Board and component temperatures are managed separately.

See it working

The process, in view.

Real PDR process footage showing the control, sensing and handling functions used across the Chipmate Auto workflow.

Live ThermoActive profile

The BGA heating profile is visible and managed throughout the process.

Focused Infrared heating

Visible, adjustable heat directed to the target component.

Automatic component removal

The dedicated Chipmate Auto sequence begins at the removal movement around 30 seconds in the supplied source.

Split-beam alignment

View the component and landing site together for accurate placement.

System capability

Built for a controlled procedure.

ThermoActive software.

Automatic thermal process management for an identical procedure on each component.

PCB preheater.

2800W three-zone medium-wave quartz infrared preheating.

Optical alignment.

Accurate placement of removed components for transfer and component replacement.

Side-view monitoring.

Live camera with image capture for process records.

Flux and paste application.

Precise application ahead of transfer or component replacement.

Assisted PCB cooling.

Stabilises the board after the procedure.

Technical specification

  • Max PCB size300 x 450 mm
  • Max component size55 x 55 mm
  • Min component size1 x 1 mm
  • Component removalAutomatic removal and placement
  • Component placementSplit beam prism, x50 magnification
  • Placement accuracyUp to 10 microns
  • Top heater power150W focused IR, up to Ø70 mm spot
  • PCB preheater power2800W medium-wave IR, 3 zones
  • Preheater heating area360 x 240 mm
  • Component sensingNon-contact IR sensor
  • PCB sensingNon-contact IR sensor
  • Thermocouple channels4