Chip-Off forensics

A controlled approach to Chip-Off forensics

Chip-off is an invasive hardware-preparation method in which a semiconductor package is physically removed from a PCB for a laboratory’s separate downstream examination workflow.

PDR equipment controls the heating, removal and model-dependent handling stage. It does not read, decode or analyse memory, and successful removal does not guarantee usable data.

Typical component packages
eMMC / eMCP
NAND Flash
UFS
CPU / SoC
Power IC
PMIC

Why thermal control matters

Chip-off is a high-consequence procedure. The selected solder joints must release while the component, PCB and surrounding assembly remain within the laboratory’s validated process limits.

Focused Infrared top heating

Adjustable infrared directs energy towards the selected component without a forced hot-air stream across the target area.

Controlled PCB preheating

Preheating manages the wider board thermal mass and helps the laboratory develop a controlled heating cycle.

Model-specific sensing

Temperature feedback, sensing and handling differ by model. Stored profiles apply to the validated device and setup, not every board universally.

Visible, documented process

The working area and ThermoActive profile remain available to the operator during applicable stages of the procedure.

Calentamiento visible por infrarrojos focalizados

Calentamiento visibleInfrarrojos focalizados sobre el componente objetivo

Los infrarrojos focalizados y ajustables dirigen la energía al componente seleccionado mientras la zona de trabajo permanece visible durante todo el procedimiento.

Perfil de calentamiento en directo en PDR ThermoActive V8

Perfil térmicoPerfiles del componente y de la PCB a la vista

El software ThermoActive muestra en directo las curvas de temperatura del componente y de la PCB frente al perfil definido, haciendo visible y repetible el proceso térmico.

Extracción controlada y concisa de un componente en Chipmate Pro

Extracción controladaEl procedimiento de extracción a la vista

Los infrarrojos focalizados calientan el componente seleccionado según su perfil definido antes de recogerlo de la placa en condiciones controladas.

Practical answers

Chip-off equipment scope.

What happens after removal?

The component moves to the laboratory’s validated reader, adapter and analysis software. Those downstream tools are separate from PDR equipment.

Does PDR recover the data?

No. PDR supplies the physical heating, removal and handling equipment; it does not extract, decode or analyse data.

Is one profile suitable for every device?

No. Profiles and temperature limits must be developed and validated for the particular device, board, component and laboratory procedure.

Which Chipmate model fits?

Chipmate is the controlled manual entry point. Chipmate Pro adds greater sensing, handling and alignment. Chipmate Auto adds the highest level of assisted handling in the range.

Demonstration, installation and training are available from PDR. Each laboratory remains responsible for validating its own procedure, device compatibility and downstream examination workflow.

Discuss your chip-off workflow

Tell PDR about the device types, laboratory process and level of handling or automation you need.